Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer

Wear

Volumn 259, Issue 7-12, 2005, Pages 1207-1214

  Li, X P ^a   He, T ^a   Rahman, M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Ductile mode cutting; Nanoscale; Silicon wafer; Tool wear

Indexed keywords

COMPUTATIONAL GEOMETRY; DUCTILITY; NANOTECHNOLOGY; SILICON WAFERS; SINGLE CRYSTALS; TOOLS;

FREE MACHINING; NANOSCALE DUCTILE MODE; SUB-CUTTING EDGES; TOOL EDGE RADIUS;

WEAR OF MATERIALS;

CUTTING TOOL; TOOL WEAR;

EID: 19944386948     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.wear.2004.12.020     Document Type: Article

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