On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications

Materials Science and Engineering A

Volumn 297, Issue 1-2, 2001, Pages 230-234

  Yan, J ^a,b   Yoshino, M ^a,c   Kuriagawa, T ^a,b   Shirakashi, T ^a,d   Syoji, K ^a   Komanduri, R ^a  

^a Oklahoma State University   (United States)

^b TOHOKU UNIVERSITY   (Japan)

^c TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^d TOKYO DENKI UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DUCTILITY; HYDROSTATIC PRESSURE; MACHINING; PRESSURE EFFECTS; SILICON;

DUCTILE MACHINING; SIDE CUTTING EDGE ANGLE; ULTRAPRECISION MACHINING;

MICROELECTROMECHANICAL DEVICES;

EID: 0035157059     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(00)01031-5     Document Type: Article

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