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International Journal of Advanced Manufacturing Technology
Volumn 32, Issue 7-8, 2007, Pages 631-637
A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers
Author keywords

Diamond tool; Ductile cutting; Edge radius; Silicon wafer
Indexed keywords

BRITTLE FRACTURE; DIAMOND CUTTING TOOLS; MICROPROCESSOR CHIPS; PHASE TRANSITIONS; SILICON WAFERS;
EID: 33947221437     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-005-0364-7     Document Type: Article
Times cited : (87)
References (9)
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    • in press
    • Liu K, Li XP, Liang SY. The mechanism of ductile chip formation in cutting of brittle materials. Inter J Adv Manu Tech (in press)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.