Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon

Journal of Manufacturing Science and Engineering

Volumn 129, Issue 2, 2007, Pages 281-286

  Cai, M B ^a   Li, X P ^a   Rahman, M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Microgroove wear; Molecular dynamics; Nanogroove wear; Nanoscale ductile mode cutting; Silicon wafer

Indexed keywords

COMPUTER SIMULATION; CRYSTALLINE MATERIALS; CUTTING; HYDROSTATIC PRESSURE; MOLECULAR DYNAMICS; SILICON WAFERS; WEAR OF MATERIALS;

MICROGROOVE WEAR; MONOCRYSTALLINE SILICON; NANOGROOVE WEAR; NANOSCALE DUCTILE MODE CUTTING;

DIAMOND CUTTING TOOLS;

EID: 34249888504     PISSN: 10871357     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2673567     Document Type: Article

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