Effect of crystallographic orientation on wear of diamond tools for nano-scale ductile cutting of silicon

Wear

Volumn 257, Issue 7-8, 2004, Pages 751-759

  Uddin, M Sharif ^a   Seah, K H W ^a   Li, X P ^a   Rahman, M ^a   Liy, K ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Crystallographic orientation; Ductile cutting; Silicon; Single crystal diamond; Tool wear

Indexed keywords

CRYSTALLOGRAPHY; DUCTILITY; MACHINING; SILICON; SINGLE CRYSTALS; WEAR OF MATERIALS;

DUCTILE CUTTING; TOOL WEAR; ULTRA-PRECISION MACHINING; WEAR MARKS;

DIAMOND CUTTING TOOLS;

CUTTING TOOL; DIAMOND; TOOL; WEAR;

EID: 11244287661     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.wear.2004.03.012     Document Type: Article

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