3D characterisation of tool wear whilst diamond turning silicon

Wear

Volumn 262, Issue 3-4, 2007, Pages 340-349

  Durazo Cardenas, I ^a   Shore, P ^a   Luo, X ^a   Jacklin, T ^b   Impey, S A ^a   Cox, A ^c  

^a CRANFIELD UNIVERSITY   (United Kingdom)

^b Laser Solutions Unit   (France)

^c Contour Fine Tooling ^*  (United Kingdom)

Author keywords

Diamond tool wear; Diamond turning; IR optics; Silicon optics; Tool life

Indexed keywords

BRITTLENESS; COOLANTS; CUTTING TOOLS; INFRARED RADIATION; SCANNING ELECTRON MICROSCOPY;

DIAMOND TOOL WEAR; DIAMOND TURNING; SILICON OPTICS; TOOL LIFE;

WEAR OF MATERIALS;

BRITTLENESS; COOLANTS; CUTTING TOOLS; INFRARED RADIATION; SCANNING ELECTRON MICROSCOPY; WEAR OF MATERIALS;

EID: 33846142158     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.wear.2006.05.022     Document Type: Article

References (20)

1. Parr-Burman P., and Shore P. Diamond turning of silicon optics. Proc. SPIE 2775 (1996) 575-584
2. Asida N., and Ben-Menachem B. Latest advances in the design and manufacture of large diameter diffractive and aspheric silicon elements for IR lens assemblies. Proc. SPIE 4820 (2003) 780-789
3. Weck M., and Fischer S. Manufacturing of microstructured surfaces using ultra-precision turning, milling and shaping. Proceedings of EUSPEN, vol. 1. Bremen, Germany, May 31-June 4 (1999) 420-423
4. De Chiffre L., Kunzmann H., Peggs G.N., and Lucca D.A. Surfaces in precision engineering, microengineering and nanotechnology. Annals of the CIRP 52/2 (2003) 561-577
5. Blackley W.S., and Scattergood R.O. Ductile-regime machining model for diamond turning of brittle materials. Precision Eng. 13/2 (1991) 95-103
6. Yan J., Syogi K., and Tamaki J. Some observations on the wear of diamond tools in ultraprecision cutting of single-crystal silicon. Wear 255 (2003) 1380-1387
7. Born D.K., and Goodman W.A. An empirical survey on the influence of machining parameters on tool wear in diamond turning of large single-crystal silicon optics. Precision Eng. 25/4 (2001) 247-257
8. Asai S., Taguchi Y., Horio K., Kasai T., and Kobayashi A. Measuring the very small cutting edge for a diamond tool using a new kind of SEM having two detectors. Ann. CIRP 39/1 (1990) 85-88
9. Sharif Uddin M., Seah K.H.W., Li X.P., Rahman M., and Liu K. Effect of crystallographic orientation on wear of diamond tools for nano-scale ductile cutting of silicon. WEAR 257 (2004) 751-759
10. Li X.P., Ramahan M., Liu K., Neo K.S., and Chan C.C. Nano-precision measurement of diamond tool edge radius for wafer fabrication. J. Mater. Process. Technol. 140 (2003) 358-362
11. Syn C.K., Taylor J.S., and Donaldson R.R. Diamond tool wear vs. cutting distance on electroless nickel mirrors. Proc. SPIE 676 (1986) 128-140
12. Shore P. Assessment of the precision and cost effectiveness of direct machining hybrid type optical surfaces for IR applications. Proc. SPIE 2576 (1995) 426-431
13. Carlisle K., Fitzpatrick J., Mckeown P., and Shore P. Review of the ultra precision machininig research facility-the 'NION' machine. Proceedings of the Third International Conference on Ultra Precision in Manufacturing Engineering UME3 (1994) 89-93
14. Chargin D. Cutting fluid study for single crystal silicon. Proceedings of ASPE Spring Topical Meeting, vol. 17 (1998) 59-62
15. Li X.P., He T., and Rahman M. Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer. Wear 259 (2005) 1207-1214
16. Wilks J. Performance of diamond as cutting tools for precision machining. Precision Eng. 2/2 (1980) 58-71
17. Scattergood R.O., and Blake N. Ductile-regime machining of germanium and silicon. J. Am. Ceram. Soc. 73/4 (1990) 949-957
18. Leung T.P., Lee W.B., and Lu X.M. Diamond turning of silicon substrates in the ductile-regime. J. Mater. Process. Technol. 73 (1998) 42-48
19. Altintas Y. Manufacturing Automation (2000), Cambridge University Press, UK pp. 57-59
20. Stanford M., and Lister P.M. Investigation into the relationship between tool wear and cutting environments when turning EN32 steel. Ind. Lubr. Technol. 56/2 (2004) 114-121