Effects of molybdate concentration on the characteristics of Ni-Mo-P diffusion barriers grown by nonisothermal electroless deposition

Journal of the Electrochemical Society

Volumn 155, Issue 9, 2008, Pages

  Chou, Yu Hsien ^a   Sung, Yuh ^b   Bai, Ching Yuan ^a   Ger, Ming Der ^a  

^a NATIONAL DEFENSE UNIVERSITY   (Taiwan)

^b CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CONCENTRATION (PROCESS); COPPER; DIFFUSION BARRIERS; ELECTROLESS PLATING; METALLIC COMPOUNDS; MOLYBDENUM; NICKEL; NICKEL ALLOYS; NONMETALS; OPTICAL INTERCONNECTS; PALLADIUM; SILICON; SILICON WAFERS;

APPLICATIONS.; BARRIER LAYER; CU INTERCONNECTS; ELECTROLESS DEPOSITION; NON-ISOTHERMAL; OPERATING CONDITIONS; P-DIFFUSION; PRE TREATMENTS; ULTRALARGE-SCALE INTEGRATION;

AMORPHOUS FILMS;

EID: 49149103434     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2946729     Document Type: Article

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