SCOPUS 정보 검색 플랫폼

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3214, Issue , 1997, Pages 21-32

Electroless Cu and barrier layers for sub-half micron multilevel interconnects

(4) Lopatin, Sergey a Shacham Diamand, Yosi a Dubin, Valery b Vasudev, P K c

a Department of Obstetrics Gynecology (United States)

b ADVANCED MICRO DEVICES (United States)

c SEMATECH (United States)

Author keywords

Barrier layer; Cu interconnects; Electroless deposition; NiP and CoWP alloys

Indexed keywords

BARRIER LAYER; CU DEPOSITIONS; CU INTERCONNECTS; CU LINES; CU SURFACES; DAMASCENE PROCESSES; DEEP TRENCHES; ELECTROLESS; ELECTROLESS DEPOSITION; LOCAL INTERCONNECTS; MULTILEVEL INTERCONNECTS; MULTILEVEL METALLIZATION; NIP AND COWP ALLOYS; SEED LAYERS; SILICIDE FORMATIONS;

ALLOYS; ASPECT RATIO; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; COBALT COMPOUNDS; COPPER; COPPER PLATING; DEPOSITION; METALLIC COMPOUNDS; OPTICAL INTERCONNECTS; PALLADIUM; SILICIDES; ULSI CIRCUITS;

COPPER ALLOYS;

EID: 33751129494 PISSN: 0277786X EISSN: None Source Type: Conference Proceeding
DOI: 10.1117/12.284661 Document Type: Conference Paper

Times cited : (6)

References (10)

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