A novel process of electroless Ni-P plating by nonisothermal method

Materials Chemistry and Physics

Volumn 89, Issue 2-3, 2005, Pages 383-389

  Ger, Ming Der ^a   Sung, Yuh ^a   Ou, Jinn Luh ^b  

^a NATIONAL DEFENSE UNIVERSITY   (Taiwan)

^b CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Nonisothermal; Reaction zone; Stabilize; Thermal gradient; Thermoelectrochemistry

Indexed keywords

BONDING; CYCLIC VOLTAMMETRY; DEPOSITION; ELECTROCHEMISTRY; MICROHARDNESS; NANOTECHNOLOGY; THERMODYNAMIC PROPERTIES; THICKNESS CONTROL;

NONISOTHERMAL; REACTION ZONE; STABILIZER; THERMAL GRADIENT; THERMOELECTROCHEMISTRY;

ELECTROLESS PLATING;

EID: 9944265704     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2004.09.018     Document Type: Article

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