Bias sputtered Ta modified diffusion barrier in Cu/Ta(Vb)/Si(111) structures

Thin Solid Films

Volumn 370, Issue 1, 2000, Pages 10-17

  Moshfegh, A Z ^a   Akhavan, O ^a  

^a SHARIF UNIVERSITY OF TECHNOLOGY   (Iran)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION IN SOLIDS; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC POTENTIAL; ELECTRIC RESISTANCE MEASUREMENT; MORPHOLOGY; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SPUTTERING; SURFACES; TANTALUM; THERMODYNAMIC STABILITY; THIN FILMS;

DIFFUSION BARRIER; FOUR POINT PROBE SHEET RESISTANCE MEASUREMENT; MULTILAYER STRUCTURES; RUTHERFORD BACKSCATTERING SPECTROMETRY;

MULTILAYERS;

EID: 0033721452     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(00)00926-3     Document Type: Article

References (34)

1. Chang C.Y., Sze S.M. ULSI Technology. 1996;McGraw-Hill, New-York.
2. Gorbatkin S.M., Poker D.B., Rhoades R.L., Doughty C., Berry L.A. J. Vac. Sci. Technol. B. 14:1996;1853.
3. Raghavan G., Chiang C., Anders P.B., et al. Thin Solid Films. 262:1995;168.
4. Hu C.-K., Luther B., Kaufman F.B., Hummel J., Uzoh C., Pearson D.J. Thin Solid Films. 262:1995;84.
5. Murarka S.P., Gutmann R.J., Kaloeros A.E., Lanford W.A. Thin Solid Films. 236:1993;257.
6. Chang C.-A. J. Appl. Phys. 67:1990;566.
7. Kattelus H.P., Nicolet M.-A. Gupta D., Ho P.S. Diffusion Phenomena in Thin Films and Microelectronic Materials. 1989;432 Noyes Publications, Park Ridge, NJ.
8. Wang S.-Q., Suthar S., Hoeflich C., Burrow B.J. J. Appl. Phys. 73:1993;2301.
9. Chang C.-A. J. Vac. Sci. Technol. A. 8:1990;3796.
10. Kolawa E., Chen J.S., Reid J.S., Pokela P.J., Nicolet M.-A. J. Appl. Phys. 70:1991;1369.
11. Holloway K., Fryer P.M., Cabral C. Jr., Harper J.M.E., Bailey P.J., Kelleher K.H. J. Appl. Phys. 71:1992;5433.
12. Clevenger L.A., Bojarczuk N.A., Holloway K., et al. J. Appl. Phys. 73:1993;300.
13. Catania P., Doyle J.P., Cuomo J.J. J. Vac. Sci. Technol. A. 10:1992;3318.
14. Itow H., Nakasaki Y., Minamihaba G., Suguro K., Okano H. Appl. Phys. Lett. 63:1993;934.
15. Ohta A., Noya A., Takeyama M., Taguchi M., Sase T., Sasaki K. Thin Solid Films. 278:1996;6.
16. Takeyama M., Noya A., Sase T., Ohta A. J. Vac. Sci. Technol. B. 14:1996;674.
17. Tsai M.H., Sun S.C., Tsai C.E., Chuang S.H., Chiu H.T. J. Appl. Phys. 79:1996;6932.
18. Stavrev M., Fischer D., Wenzel C., Drescher K., Mattern N. Thin Solid Films. 307:1997;79.
19. Imahori J., Oku T., Murakami M. Thin Solid Films. 301:1997;142.
20. Lee Y.-J., Sun B.-S., Rha S.-K., Park C.-O. Thin Solid Films. 320:1998;140.
21. Yoon D.-S., Baik H.K., Lee S.-M. J. Appl. Phys. 83:1998;1333.
22. Kwak J.S., Baik H.K., Kim J.-H., Lee S.-M. Appl. Phys. Lett. 72:1998;2832.
23. Moshfegh A.Z., Shafiee M.M., Akhavan O. Firrao D., Mittemeijer E.J. 11th Congress of the International Federation for Heat Treatment and Surface Engineering. Vol. 2:October 19-21, 1998;69.
24. Catania P., Roy R.A., Cuomo J.J. J. Appl. Phys. 74:1993;1008.
25. Maissel L.I., Schaible P.M. J. Appl. Phys. 35:1965;237.
26. Baker P.N. Thin Solid Films. 14:1972;3 and references therein.
27. Westwood W.D., Livermore F.C. Thin Solid Films. 5:1970;407.
28. Hinode K., Homma Y., Horiuchi M., Takahashi T. J. Vac. Sci. Technol. A. 15:1997;2017.
29. Kang B.S., Lee S.-M., Kawk J.S., Yoon D.-S., Baik H.K. J. Electrochem. Soc. 144:1997;1807.
30. Aleshin A.N., Bokstein B.S., Egorov V.K., Kurkin P.V. Thin Solid Films. 275:1996;144.
31. A.Z. Moshfegh, O. Akhavan, unpublished.
32. Ohring M. The Materials Science of Thin Films. 1992;Academic Press, New York.
33. Kwak J.S., Baik H.K., Kim J.-H., Lee S.-M. Appl. Phys. Lett. 71:1997;2451.
34. Harrison T.R. Trans. Faraday. Soc. 57:1961;1191.