Displacement Activation of Tantalum Diffusion Barrier Layer for Electroless Copper Deposition

Journal of the Electrochemical Society

Volumn 148, Issue 9, 2001, Pages

  Hsu, Hong Hui ^a   Hsieh, Chao Chan ^a   Chen, Min Hsian ^a   Lin, Su Jien ^a   Yeh, Jien Wei ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001593208     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1387982     Document Type: Article

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