Evaluation of electroless deposited Co(W,P) thin films as diffusion barriers for copper metallization

Microelectronic Engineering

Volumn 55, Issue 1-4, 2001, Pages 297-303

  Kohn, A ^a   Eizenberg, M ^a   Shacham Diamand, Y ^b   Israel, B ^b   Sverdlov, Y ^b  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^b TEL AVIV UNIVERSITY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; DIFFUSION; ELECTROLESS PLATING; GRAIN BOUNDARIES; METALLIZING; NANOSTRUCTURED MATERIALS; THIN FILMS;

DIFFUSION BARRIERS;

SEMICONDUCTING FILMS;

EID: 0034830082     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(00)00460-3     Document Type: Article

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