Fabrication of potential NiMoP diffusion barrier/seed layers for Cu interconnects via electroless deposition

Journal of Electronic Materials

Volumn 34, Issue 5, 2005, Pages 541-550

  Wu, Y ^a   Wan, C C ^a   Wang, Y Y ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Barrier; Cu interconnects; Electroless; NiMoP; Seed layer

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; COPPER; CRYSTAL STRUCTURE; ELECTROLESS PLATING; FABRICATION; MOLYBDENUM; OPTICAL INTERCONNECTS; SURFACE PROPERTIES; X RAY DIFFRACTION ANALYSIS;

BARRIER; CU INTERCONNECTS; ELECTROLESS; NIMOP; SEED LAYER;

NICKEL COMPOUNDS;

EID: 20344407063     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0063-z     Document Type: Conference Paper

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