Effect of composition on thermal stability and electrical resistivity of Ta-Si-N films

Thin Solid Films

Volumn 365, Issue 1, 2000, Pages 19-21

  Olowolafe, J O ^a   Rau, I ^a   Unruh, K M ^a   Swann, C P ^a   Jawad, Z S ^b   Alford, T ^b  

^a UNIVERSITY OF DELAWARE   (United States)

^b ARIZONA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; CRYSTALLIZATION; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC RESISTANCE MEASUREMENT; HEAT TREATMENT; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SPUTTERING; TANTALUM ALLOYS; THERMAL EFFECTS; THERMODYNAMIC STABILITY; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

SHEET RESISTANCE MEASUREMENT;

METALLIC FILMS;

EID: 0033902132     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(99)01113-X     Document Type: Article

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