The role of microstructure in nanocrystalline conformal Co 0.9 W 0.02 P 0.08 diffusion barriers for copper metallization

Applied Surface Science

Volumn 212-213, Issue SPEC., 2003, Pages 367-372

  Kohn, A ^a   Eizenberg, M ^a   Shacham Diamand, Y ^b  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^b TEL AVIV UNIVERSITY   (Israel)

Author keywords

Diffusion barrier; Electroless deposition; Interconnects

Indexed keywords

CRYSTALLIZATION; DIFFUSION; ELECTROLESS PLATING; METALLIZING; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS;

DIFFUSION BARRIERS;

COBALT COMPOUNDS;

EID: 0038241571     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(03)00116-8     Document Type: Conference Paper

References (18)

1. M.T. Bohr, Int. Elecrt. Dev. Meet. Techn. Digest 241 (1995).
2. S.P. Murarka, I.V. Verner, R.J. Gutmann, Copper - Fundamental Mechanisms for Microelectronic Applications, Wiley, New York, 2000.
3. Shacham-Diamand Y., Dedhia A., Hoffsetter D., Oldham W.G., J. Electrochem. Soc. 140:1993;2427.
4. Istratov A.A., Weber E.R., Appl. Phys. A. 66:1998;123.
5. SIA International Technology Roadmap for Semiconductors, Semiconductor Industry Association, San Jose, CA, 2001.
6. Kohn A., Eizenberg M., Shacham-Diamand Y., Israel B., Sverdlov Y., Microelectr. Eng. 55:2001;297.
7. O'Sullivan E.J., Schrott A.G., Paunovic M., Sambuccetti C.J., Marino J.R., Baily P.J., Kaja S., Semkow K.W., IBM J. Res. Dev. 42:1998;607.
8. Hüller K., Sydow M., Dietz G., J. Magn. Magn. Mater. 53:1985;269.
9. S. Lopatin, Y. Shacham Diamand, V. Dubin, P.K. Vasudev, in: Proceedings of the 14th International VLSI Multilevel Interconnection Conference, VMIC, vol. 219, 1997.
10. Ishida K., Nishizawa T., Bull. Alloy Phase Diagrams. 11:1990;555.
11. S.V. Nagender Naidi, A.M. Sriramamurthy, P. Rama Rao, Phase Diagrams of Binary Tungsten Alloys, vol. 60, Indian Institute of Metals, 1998.
12. Nicolet M.-A., Thin Solid Films. 52:1978;415.
13. Kohn A., Eizenberg M., Shacham-Diamand Y., Sverdlov Y., Mater. Sci. Eng. A. 302:2001;18.
14. K.I. Chopra, Thin Film Phenomena, McGraw-Hill, New York, 1969.
15. Ballufi R.W., Blakely J.M., Thin Solid Films. 25:1975;363.
16. I. Kaur, Y. Mishin, W. Gust, Fundamentals of Grain and Interphase Boundary Diffusion, Wiley, Chichester, UK, 2000.
17. Kohn A., Eizenberg M., Shacham-Diamand Y., J. Appl. Phys. 92:2002;5508.
18. Mishin Y., Herzig Chr., Mater. Sci. Eng. A. 260:1999;55.