Three-dimensional integration in microelectronics: Motivation, processing, and thermomechanical modeling

Chemical Engineering Communications

Volumn 195, Issue 8, 2008, Pages 847-888

  Cale, Timothy S ^a   Lu, Jian Qiang ^b   Gutmann, Ronald J ^b  

^a ARIZONA STATE UNIVERSITY   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

BCB bonding; Grain boundary migration; Grain continuum modeling; Three dimensional integration; Through silicon vias

Indexed keywords

CONTINUUM MECHANICS; GRAIN BOUNDARIES; INTEGRATION; MICROPROCESSOR CHIPS; SEMICONDUCTING SILICON; THREE DIMENSIONAL;

GRAIN BOUNDARY MIGRATION; GRAIN CONTINUUM MODELING; THERMOMECHANICAL MODELING; THREE-DIMENSIONAL INTEGRATION;

MICROELECTRONICS;

CONTINUUM MECHANICS; GRAIN BOUNDARIES; INTEGRATION; MICROELECTRONICS; MICROPROCESSOR CHIPS; SEMICONDUCTING SILICON; THREE DIMENSIONAL;

EID: 43149092706     PISSN: 00986445     EISSN: 15635201     Source Type: Journal    
DOI: 10.1080/00986440801930302     Document Type: Review

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