Benzocyclobutene (DVS-BCB) polymer as an interlay er dielectric (ILD) material

Microelectronic Engineering

Volumn 33, Issue 1-4, 1997, Pages 327-334

  Mills, Michael E ^a   Townsend, Paul ^a   Castillo, Dan ^a   Martin, Steve ^a   Achen, Albert ^b  

^a DOW CHEMICAL COMPANY   (United States)

^b Dow Deutschland GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; FILM GROWTH; INTEGRATED CIRCUIT MANUFACTURE; PERMITTIVITY; SEMICONDUCTING POLYMERS; THERMODYNAMIC STABILITY; WATER ABSORPTION;

DIVINYLSILOXANE BISBENZOCYCLOBUTENE (DVS BCB) POLYMER; INTERLAYER DIELECTRIC (ILD) MATERIAL; RESIST SPIN TRACK EQUIPMENT;

DIELECTRIC FILMS;

EID: 0002701650     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0167-9317(96)00061-5     Document Type: Article

References (15)

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