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Volumn , Issue , 2004, Pages 96-97

Three-dimensional circuit integration based on self-synchronized RF-interconnect using capacitive coupling

Author keywords

[No Author keywords available]

Indexed keywords

BASEBAND SIGNALS; CAPACITIVE COUPLING; CIRCUIT INTEGRATION; SIGNAL JITTER;

EID: 4544353283     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (6)

References (7)
  • 1
    • 38649095372 scopus 로고    scopus 로고
    • Crosstalk noise analysis in ultra deep submicrometer technologies
    • Feb.
    • M.A. Elgamel, K.S. Tharmalingam, M.A. Bayoumi, "Crosstalk Noise Analysis in Ultra Deep Submicrometer Technologies", VLSI 2003, pp. 189-192, Feb. 2003.
    • (2003) VLSI 2003 , pp. 189-192
    • Elgamel, M.A.1    Tharmalingam, K.S.2    Bayoumi, M.A.3
  • 2
    • 84962920831 scopus 로고    scopus 로고
    • Comparison of key performance metrics in two- And three-dimensional integrated circuits
    • June
    • A. Rahman, A. Fan, R. Reif, "Comparison of Key Performance Metrics in Two- and Three-Dimensional Integrated Circuits", Proc. of IEEE International Interconnect Tech. Conf., pp. 157-159, June 2000.
    • (2000) Proc. of IEEE International Interconnect Tech. Conf. , pp. 157-159
    • Rahman, A.1    Fan, A.2    Reif, R.3
  • 3
    • 0029205166 scopus 로고
    • Modeling the impact of 3-D technology on the performance of the memory hierarchy of RISC systems
    • M.B. Kleiner, S.A. Kuhn, W. Weber, "Modeling the Impact of 3-D Technology on the Performance of the Memory Hierarchy of RISC Systems", ISCAS'95, Vol. 3, 1995.
    • (1995) ISCAS'95 , vol.3
    • Kleiner, M.B.1    Kuhn, S.A.2    Weber, W.3
  • 4
    • 0034860973 scopus 로고    scopus 로고
    • Determining the inductance of a through-substrate via using multiple on-wafer test approaches
    • March
    • R. Uscola, M.Tutt, "Determining the Inductance of a Through-Substrate Via Using Multiple On-Wafer Test Approaches", Proc. IEEE 2001 Int. Conf. on Microelectronic Test Structures, Vol 14, March 2001.
    • (2001) Proc. IEEE 2001 Int. Conf. on Microelectronic Test Structures , vol.14
    • Uscola, R.1    Tutt, M.2
  • 6
    • 0036316111 scopus 로고    scopus 로고
    • RF-interconnect for multi-Gb/s digital interface based on 10GHz RF-modulation in 0.18μm CMOS
    • June
    • H. Shin, Z. Xu, M.F. Chang, "RF-Interconnect for Multi-Gb/s Digital Interface Based on 10GHz RF-Modulation in 0.18μm CMOS", 2002 IEEE MTT-S International, Vol.1, June 2002.
    • (2002) 2002 IEEE MTT-S International , vol.1
    • Shin, H.1    Xu, Z.2    Chang, M.F.3
  • 7
    • 0037028234 scopus 로고    scopus 로고
    • Estimation of signal-to-noise ratio improvement in RF-interconnect
    • Dec.
    • H. Shin, Z. Xu, K. Miyashiro, M.F. Chang, "Estimation of Signal-to-Noise Ratio Improvement in RF-Interconnect", Electronics Letters, Vol. 38, NO. 25, Dec 2002
    • (2002) Electronics Letters , vol.38 , Issue.25
    • Shin, H.1    Xu, Z.2    Miyashiro, K.3    Chang, M.F.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.