2.8Gb/s inductively coupled interconnect for 3-D ICs

IEEE Symposium on VLSI Circuits, Digest of Technical Papers

Volumn 2005, Issue , 2005, Pages 352-355

  Xu, Jian ^a   Wilson, John ^a   Mick, Stephen ^a   Luo, Lei ^a   Franzon, Paul ^a  

^a North Carolina State University   (United States)

Author keywords

3 D ICs; ACCI; Inductive coupling; Transceiver; Transformer; Vertical signaling

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRIC INDUCTORS; ENERGY DISSIPATION; INDUCTIVELY COUPLED PLASMA; TRANSCEIVERS;

3-D ICS; ACCIINDUCTIVE COUPLING; INDUCTIVE COUPLING; TRANSFORMER; VERTICAL SIGNALING;

INTERCONNECTION NETWORKS;

EID: 33745123360     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. S. Mick, J. Wilson and P. Franzon, "4 Gbps high-density AC coupled interconnection," CICC, Proceedings of the IEEE, pp. 133-140, May 2002.
2. L. Luo, J. Wilson, S. Mick, J. Xu, L. Zhang, P. Franzon, "3Gb/s AC-coupled chip-to-chip communication using a low-swing pulse receiver", ISSCC Dig. Tech. Papers, Feb. 2005, in press.
3. J. Xu, S. Mick, J. Wilson, L. Luo, K. Chandrasekar, E. Erickson and P. Franzon, "AC coupled interconnect for dense 3-D systems", IEEE Trans. on Nuclear Science, vol. 51, no. 5, pp. 2156-2160, Oct. 2004.
4. D. Mizoguchi, Y.B. Yusof, N. Miura, T. Sakurai and T. Kuroda, "A 1.2Gb/s/pin wireless super-connect based on inductive inter-chip signaling," ISSCC Dig. Tech. Papers, pp. 142-143, Feb. 2004.
5. N. Miura, D. Mizoguchi, Y.B. Yusof, T. Sakurai, and T. Kuroda, "Analysis and design of transceiver circuit and inductor layout for inductive inter-chip wireless superconnect," Symposium on VLSI Circuits, Dig. Tech. Papers, pp. 246-249, June 2004.
6. A.M. Niknejad, "Analysis and simulation of spiral inductors and transformers for ICs (ASITIC)," [online] available: http://rfic.eecs.berkeley.edu/niknejad/asitic.html