메뉴 건너뛰기




Volumn 129, Issue 1, 2007, Pages 82-89

Experimental observation of correlation between creep and uniaxial ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu solder alloys

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSION TESTING; CREEP; LEAD; SOLDERED JOINTS; STRAIN RATE; TENSILE TESTING;

EID: 38749127944     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2429714     Document Type: Article
Times cited : (9)

References (32)
  • 1
    • 4744352564 scopus 로고    scopus 로고
    • PlasticityCreep Separation Method for Viscoplastic Deformation of Lead-Free Solders
    • Ohguchi, K., Sasaki. K., Ishibashi, M., and Hoshino, T., 2004, "PlasticityCreep Separation Method for Viscoplastic Deformation of Lead-Free Solders" JSME Int. J., Ser. A, 47, pp. 371-379.
    • (2004) JSME Int. J., Ser. A , vol.47 , pp. 371-379
    • Ohguchi, K.1    Sasaki, K.2    Ishibashi, M.3    Hoshino, T.4
  • 2
    • 0038893345 scopus 로고    scopus 로고
    • Creep Analysis of Wafer Level Chip Scale Packaging (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board
    • Lau. J. H. Pan, S. H., and Chang, C., 2002, "Creep Analysis of Wafer Level Chip Scale Packaging (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board," ASME J. Electron. Packag., 124, pp. 69-76.
    • (2002) ASME J. Electron. Packag , vol.124 , pp. 69-76
    • Lau, J.H.1    Pan, S.H.2    Chang, C.3
  • 3
    • 85199265064 scopus 로고    scopus 로고
    • PJ Vaynnuin. S., and McKeown. S,-A., 1993, Energy-Based Methodology for Fatigue Life Prediction of Solder Materials, IEEE Trans. Compon., Hybrids, Manuf. Technol., 16, pp. 317-322.
    • PJ Vaynnuin. S., and McKeown. S,-A., 1993, "Energy-Based Methodology for Fatigue Life Prediction of Solder Materials," IEEE Trans. Compon., Hybrids, Manuf. Technol., 16, pp. 317-322.
  • 4
    • 0029322231 scopus 로고
    • Energy Approach to the Fatigue of 60/Sn Solder: Part I-Influence of Temperature and Cyclic Frequency
    • Solomon, H. D., and Tolksdorf, E. D., 1995, "Energy Approach to the Fatigue of 60/Sn Solder: Part I-Influence of Temperature and Cyclic Frequency," ASME J. Electron. Packag., 117, pp. 130-135.
    • (1995) ASME J. Electron. Packag , vol.117 , pp. 130-135
    • Solomon, H.D.1    Tolksdorf, E.D.2
  • 5
    • 0030231010 scopus 로고    scopus 로고
    • Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity
    • Ishikawa, H., Sasaki, K., and Ohguchi, K., 1996, "Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity," ASME J. Electron. Packag., 118, pp. 164-169.
    • (1996) ASME J. Electron. Packag , vol.118 , pp. 164-169
    • Ishikawa, H.1    Sasaki, K.2    Ohguchi, K.3
  • 6
    • 0037233305 scopus 로고    scopus 로고
    • Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy
    • Shi, X. Q., Wang, Z. P., Yang, Q. J., and Pang, H. L. J., 2003, "Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy," ASME J. Eng. Mater. Technol., 125, pp. 81-88.
    • (2003) ASME J. Eng. Mater. Technol , vol.125 , pp. 81-88
    • Shi, X.Q.1    Wang, Z.P.2    Yang, Q.J.3    Pang, H.L.J.4
  • 7
    • 0032630572 scopus 로고    scopus 로고
    • Deformation Behavior of Two Lead-Free Solders: Indalloy 227 and Castin Alloy
    • Whitelaw, R. S., Neu, R. W., and Scott, D. T., 1999, "Deformation Behavior of Two Lead-Free Solders: Indalloy 227 and Castin Alloy," ASME J. Electron. Packag., 121, pp. 99-107.
    • (1999) ASME J. Electron. Packag , vol.121 , pp. 99-107
    • Whitelaw, R.S.1    Neu, R.W.2    Scott, D.T.3
  • 8
    • 0345826453 scopus 로고    scopus 로고
    • Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens
    • Ren, W., Qian, Z., Lu, M., and Liu, S., 1999, "Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens," ASME J. Electron. Packag., 121, pp. 271-274.
    • (1999) ASME J. Electron. Packag , vol.121 , pp. 271-274
    • Ren, W.1    Qian, Z.2    Lu, M.3    Liu, S.4
  • 9
    • 0037081573 scopus 로고    scopus 로고
    • The Influence of Prior Strain Rate on Stress Relaxation in Solder Alloys
    • Woodmansee, M. W., and Neu, R. W., 2002, "The Influence of Prior Strain Rate on Stress Relaxation in Solder Alloys," Mater. Sci. Eng., A, 322, pp. 79-88.
    • (2002) Mater. Sci. Eng., A , vol.322 , pp. 79-88
    • Woodmansee, M.W.1    Neu, R.W.2
  • 10
    • 3142778461 scopus 로고    scopus 로고
    • Some Mechanical Properties of Sn-3.5Ag Eutectic Alloy at Different Temperatures
    • Bahay, M. M., Mossalamy, M. E. EL., Mahdy, M., and Bahgat, A. A., 2004, "Some Mechanical Properties of Sn-3.5Ag Eutectic Alloy at Different Temperatures," J. Mater. Sci., 15, pp. 519-526.
    • (2004) J. Mater. Sci , vol.15 , pp. 519-526
    • Bahay, M.M.1    Mossalamy, M.E.E.2    Mahdy, M.3    Bahgat, A.A.4
  • 11
    • 10044275284 scopus 로고    scopus 로고
    • Creep Behavior of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder-Part I: As-Cast Condition
    • Vianco, P. T., Rejent, J. A., and Kilgo, A. C., 2004, "Creep Behavior of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder-Part I: As-Cast Condition," J. Electron. Mater., 33, pp. 1389-1400.
    • (2004) J. Electron. Mater , vol.33 , pp. 1389-1400
    • Vianco, P.T.1    Rejent, J.A.2    Kilgo, A.C.3
  • 12
    • 0036865516 scopus 로고    scopus 로고
    • Creep Behavior of Eutectic Sn-Ag Lead-Free Solder Alloy
    • Huang, M. L., Wang, L., and Wu, C. M. L., 2002, "Creep Behavior of Eutectic Sn-Ag Lead-Free Solder Alloy," J. Mater. Res., 17, pp. 2897-2903.
    • (2002) J. Mater. Res , vol.17 , pp. 2897-2903
    • Huang, M.L.1    Wang, L.2    Wu, C.M.L.3
  • 13
    • 0036809677 scopus 로고    scopus 로고
    • Study on the Microstructure of a Novel Lead-Free Solder Alloy SnAgCu-RE and Its Soldered Joints
    • Chen, Z. G., Shi, Y W., Xia, Z. D., and Yan, Y F., 2002, "Study on the Microstructure of a Novel Lead-Free Solder Alloy SnAgCu-RE and Its Soldered Joints," J. Electron. Mater., 31, pp. 1122-1128.
    • (2002) J. Electron. Mater , vol.31 , pp. 1122-1128
    • Chen, Z.G.1    Shi, Y.W.2    Xia, Z.D.3    Yan, Y.F.4
  • 14
    • 14644398543 scopus 로고    scopus 로고
    • Tensile Creep and Microstructural Characterization of Bulk Sn3.9Ag0.6Cu Lead-Free Solder
    • Xiao, Q., and Armstrong, W. D., 2005, "Tensile Creep and Microstructural Characterization of Bulk Sn3.9Ag0.6Cu Lead-Free Solder," J. Electron. Mater., 34, pp. 196-211.
    • (2005) J. Electron. Mater , vol.34 , pp. 196-211
    • Xiao, Q.1    Armstrong, W.D.2
  • 15
    • 0032027831 scopus 로고    scopus 로고
    • A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects
    • Fu, C.-Y., McDowell, D. L., and Ume, I. C., 1998, "A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects," ASME J. Electron. Packag., 120, pp. 24-34.
    • (1998) ASME J. Electron. Packag , vol.120 , pp. 24-34
    • Fu, C.-Y.1    McDowell, D.L.2    Ume, I.C.3
  • 16
    • 0037409962 scopus 로고    scopus 로고
    • Time-Dependent Cyclic Deformation and Failure of 63Sn/37Pb Solder Alloy
    • Yang, X. J., Chow, C. L., and Lau, K. J., 2003, "Time-Dependent Cyclic Deformation and Failure of 63Sn/37Pb Solder Alloy," Int. J. Fatigue, 25, pp. 533-546.
    • (2003) Int. J. Fatigue , vol.25 , pp. 533-546
    • Yang, X.J.1    Chow, C.L.2    Lau, K.J.3
  • 17
    • 0032027467 scopus 로고    scopus 로고
    • Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1-Theory and Formulation
    • Basaran, C., Desai, C. S., and Kundu, T., 1998, "Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1-Theory and Formulation," ASME J. Electron. Packag., 120, pp. 41-47.
    • (1998) ASME J. Electron. Packag , vol.120 , pp. 41-47
    • Basaran, C.1    Desai, C.S.2    Kundu, T.3
  • 18
    • 0032028050 scopus 로고    scopus 로고
    • Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2-Verification and Application
    • Basaran, C., Desai, C. S., and Kundu, T., 1998, "Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2-Verification and Application," ASME J. Electron. Packag., 120, pp. 48-53.
    • (1998) ASME J. Electron. Packag , vol.120 , pp. 48-53
    • Basaran, C.1    Desai, C.S.2    Kundu, T.3
  • 19
    • 0032626766 scopus 로고    scopus 로고
    • Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)
    • Maciucescu, L., Sham, T.-L., and Krempl, E., 1999, "Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)," ASME J. Electron. Packag., 121, pp. 92-98.
    • (1999) ASME J. Electron. Packag , vol.121 , pp. 92-98
    • Maciucescu, L.1    Sham, T.-L.2    Krempl, E.3
  • 20
    • 0032662166 scopus 로고    scopus 로고
    • Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading
    • Chandaroy, R., and Basaran, C., 1999, "Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading," ASME J. Electron. Packag., 121, pp. 61-68.
    • (1999) ASME J. Electron. Packag , vol.121 , pp. 61-68
    • Chandaroy, R.1    Basaran, C.2
  • 21
    • 0040675414 scopus 로고    scopus 로고
    • Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering
    • Fu, C.-Y., McDowell, D. L., and Ume, I. C., 2002, "Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering," ASME J. Electron. Packag., 124, pp. 45-53.
    • (2002) ASME J. Electron. Packag , vol.124 , pp. 45-53
    • Fu, C.-Y.1    McDowell, D.L.2    Ume, I.C.3
  • 22
    • 0027066363 scopus 로고
    • A Nonlinear Kinematic Hardening Theory for Cyclic Thermoplasticity and Thermoviscoplasticity
    • McDowell, D. L., 1992, "A Nonlinear Kinematic Hardening Theory for Cyclic Thermoplasticity and Thermoviscoplasticity," Int. J. Plast., 8, pp. 695-728.
    • (1992) Int. J. Plast , vol.8 , pp. 695-728
    • McDowell, D.L.1
  • 23
    • 0040748904 scopus 로고    scopus 로고
    • Applying Anand Model to Represent the Viscoplastic Behavior of Solder Alloys
    • Wang, G. Z., Cheng, Z. N., Backer, K., and Wild, J., 2001, "Applying Anand Model to Represent the Viscoplastic Behavior of Solder Alloys," ASME J. Electron, Packag., 123, pp. 247-253.
    • (2001) ASME J. Electron, Packag , vol.123 , pp. 247-253
    • Wang, G.Z.1    Cheng, Z.N.2    Backer, K.3    Wild, J.4
  • 24
    • 0040671358 scopus 로고    scopus 로고
    • A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders
    • Yi, S., Luo, C., and Chian, K. S., 2002, "A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders," ASME J. Electron. Packag., 124, pp. 91-96.
    • (2002) ASME J. Electron. Packag , vol.124 , pp. 91-96
    • Yi, S.1    Luo, C.2    Chian, K.S.3
  • 25
    • 0034844956 scopus 로고    scopus 로고
    • Description of Temperature Dependence and Creep Deformation of 60Sn-40Pb Solder Alloys
    • Ohguchi, K., and Sasaki, K., 2001, "Description of Temperature Dependence and Creep Deformation of 60Sn-40Pb Solder Alloys," JSME Int. J., Ser. A, 44, pp. 82-88.
    • (2001) JSME Int. J., Ser. A , vol.44 , pp. 82-88
    • Ohguchi, K.1    Sasaki, K.2
  • 26
    • 0041905237 scopus 로고    scopus 로고
    • Viscoplastic Deformation of 40Pb/60Sn Solder Alloys-Experiments and Constitutive Modeling
    • Sasaki, K., Ohguchi, K., and Ishikawa, H., 2001, "Viscoplastic Deformation of 40Pb/60Sn Solder Alloys-Experiments and Constitutive Modeling," ASME J. Electron. Packag., 123, pp. 379-387.
    • (2001) ASME J. Electron. Packag , vol.123 , pp. 379-387
    • Sasaki, K.1    Ohguchi, K.2    Ishikawa, H.3
  • 27
    • 0348108171 scopus 로고    scopus 로고
    • Elastic-Plastic-Creep Simulation of Pb/Sn Solder Alloys by Separation of Plastic and Creep
    • Ohguchi, K., and Sasaki, K., 2003, "Elastic-Plastic-Creep Simulation of Pb/Sn Solder Alloys by Separation of Plastic and Creep," JSME Int. J., Ser. A, 46, pp. 559-566.
    • (2003) JSME Int. J., Ser. A , vol.46 , pp. 559-566
    • Ohguchi, K.1    Sasaki, K.2
  • 28
    • 17144440206 scopus 로고    scopus 로고
    • Viscoplastic Deformation of Lead Free Solder Alloy-Experiments and Simulations
    • Sasaki, K., Yanagimoto, A., and Ishikawa, H., 2003, "Viscoplastic Deformation of Lead Free Solder Alloy-Experiments and Simulations," Key Eng. Mater., 233-236, pp. 779-784.
    • (2003) Key Eng. Mater , vol.233-236 , pp. 779-784
    • Sasaki, K.1    Yanagimoto, A.2    Ishikawa, H.3
  • 29
    • 32644446388 scopus 로고    scopus 로고
    • A Quantitative Evaluation of Time-Independent and Time-Dependent Deformations of Lead-Free and Lead-Containing Solder Alloys
    • Ohguchi, K., Sasaki, K., and Ishibashi, M., 2006, "A Quantitative Evaluation of Time-Independent and Time-Dependent Deformations of Lead-Free and Lead-Containing Solder Alloys," J. Electron. Mater., 35, pp. 132-139.
    • (2006) J. Electron. Mater , vol.35 , pp. 132-139
    • Ohguchi, K.1    Sasaki, K.2    Ishibashi, M.3
  • 30
  • 31
    • 11344272790 scopus 로고    scopus 로고
    • Effects of Cooling Rate on Creep Behavior of a Sn-3.5Ag Alloy
    • Ochoa, F., Deng, X., and Chawla, N., 2004, "Effects of Cooling Rate on Creep Behavior of a Sn-3.5Ag Alloy," J. Electron. Mater., 33, pp. 1596-1607.
    • (2004) J. Electron. Mater , vol.33 , pp. 1596-1607
    • Ochoa, F.1    Deng, X.2    Chawla, N.3
  • 32
    • 25444446349 scopus 로고    scopus 로고
    • Investigation of Subsequent Viscoplastic Deformation of Austenitic Stainless Steel Subjected to Cyclic Preloading
    • Mayama, T., and Sasaki, K., 2006, "Investigation of Subsequent Viscoplastic Deformation of Austenitic Stainless Steel Subjected to Cyclic Preloading," Int. J. Plast., 22, pp. 374-390.
    • (2006) Int. J. Plast , vol.22 , pp. 374-390
    • Mayama, T.1    Sasaki, K.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.