A finite element procedure of a cyclic thermoviscoplasticity model for solder and copper interconnects

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 1, 1998, Pages 24-34

  Fu, C ^a   McDowell, D L ^a   Ume, I C ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COPPER; CREEP TESTING; ELECTRONICS PACKAGING; FATIGUE TESTING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; TENSILE TESTING; THERMOMECHANICAL TREATMENT; TORSION TESTING; VISCOPLASTICITY;

RATCHETTING TESTS;

SOLDERED JOINTS;

EID: 0032027831     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792281     Document Type: Article

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