Description of temperature dependence and creep deformation of 60 Sn-40 Pb solder alloys

JSME International Journal, Series A: Solid Mechanics and Material Engineering

Volumn 44, Issue 1, 2001, Pages 82-88

  Ohguchi, Ken Ichi ^a   Sasaki, Katsuhiko ^b  

^a AKITA UNIVERSITY   (Japan)

^b HOKKAIDO UNIVERSITY   (Japan)

Author keywords

60 Sn 40 Pb solder alloys; Constitutive model; Creep; Cyclic loading; Electronic packaging; Temperature effect; Viscoplasticity

Indexed keywords

COMPUTER SIMULATION; CREEP; THERMAL EFFECTS; VISCOPLASTICITY;

CREEP DEFORMATION;

SOLDERING ALLOYS;

ALLOY; CREEP; DEFORMATION; FATIGUE; LOADING; TEMPERATURE EFFECT;

EID: 0034844956     PISSN: 13447912     EISSN: None     Source Type: Journal    
DOI: 10.1299/jsmea.44.82     Document Type: Article

References (6)

1. Fatigue of 60/40 solder
2. Thermal fatigue life of Pb-Sn alloy interconnections
3. Creep-fatigue life of solder based on creep characteristics
4. Analytical and experimental hybrid study on thermal fatigue strength of electronic solder joints (1st report, rationalization of accelerated thermal cyclic test and evaluation of thermal fatigue)
5. Prediction of fatigue failure of 60 Sn-40 Pb solder using constitutive model for cyclic viscoplasticity
6. Viscoplastic deformation of 60 Sn-40 Pb solder alloys (Description of strain rate effect)