Viscoplastic deformation of 40 pb/60sn solder alloys -experiments and constitutive modeling

Journal of Electronic Packaging

Volumn 123, Issue 4, 2001, Pages 379-387

  Sasaki, Katsuhiko ^a   Ohguchi, Ken Ichi ^b   Ishikawa, Hiromasa ^a  

^a HOKKAIDO UNIVERSITY   (Japan)

^b AKITA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041905237     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1371927     Document Type: Article

References (22)

1. Shine, M. C., and Fox, L. R., 1988, "Fatigue of Solder Joints in Surface Mount Devices," Low-Cycle Fatigue, ASTM STP 942, H. D. Solomon et al., eds., ASTM, Philadelphia, Pa, pp. 588-610.
2. Solomon, H. D., 1989. "Strain-Life Behavior in 60/40 Solder," ASME J. Elec-tron. Packag., 111, pp. 75-82.
3. Satoh, R., Arakawa, K., Harada, M., and Matsui, K., 1991, "Thermal Fatigue Life of Ph-Sn Alloy interconnections," IEEE Trans. Compon., Hybrids, Manuf. Teehnol., 14, No. I, pp. 224-231.
4. Pao, Y.-H., Govila, R., Badgley, S., and Jih, E., 1993, "An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints," ASME J. Electron. Packag., 115, pp. 1-8.
5. Vaynman, S., and McKeown, S.-A., 1993. "Energy-Based Methodology for Fatigue Life Prediction of Solder Materials," IEEE Trans. Compon., Hyhrids, Manuf. Teehnol., 16, pp. 317-322.
6. Solomon, H. D., and Tolksdorf, E. D., 1995, "Energy Approach to lhe Fatigue of 60/40 Solder: Pan !-Influence of Temperature and Cycle Frequency," ASME J. Electron. Packag., 117, pp. 130-135.
7. Subbarayan, G., 1996. "A Procedure for Automated Shape and Life Prediction in Flip-Chip and BG Solder Joints," ASME J. Electron. Packag., 118. pp. 127-133.
8. Guo, Z., and Conrad, H., 1996. "Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints," ASME J. Electron. Packag., 118. pp. 49-54.
9. Shiratori, M., and Yu. Q., 1997, "Life Assessment of Solder Joint," Advances in Electronic Packaging. EEP Vol. 19-2. ASME. New York. pp. 1471-1477.
10. Kitano. M., and Honda, M., 1997. "Shape Prediction of Solder Bump Joint by Surface Tension Analysis and Fatigue Strength Evaluation," Advances in Elec-tronic Packaging 1997. EEP Vol. 19-2. ASME, New York. pp. 1407-1412.
11. Ishikawa, H., Sasaki. K., and Ohguchi, K., 1996. "Prediction of Fatigue Fail-ure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity," ASME J. Electron. Packag., 118. pp. 164-169.
12. Paydar, N., Tong, Y., and Akay. H. U., 1994. "A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints," ASME J. Electron. Packag., 116. pp. 265-273.
13. Bhatti, P. K., Gschwend. K., Kwang. A. Y., and Syed. R. A., 1995, "Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Device," ASME J. Electron. Packag., 117. pp. 20-25.
14. Ling. S., and Dasgupta. A., 1997. "A Nonlinear Multi-Domain Thermome-chanical Stress Analysis Method for Surface-Mount Solder Joints-Part (I: Viscoplastic Analysis," ASME J. Electron. Packag., 119. pp. 177-182.
15. Fu, C., McDowell. D. L., and Ume, I. C., 1998, "A Finite Element Procedure of a Cyclic Thermoviscoplasticily Model for Solder and Copper Intercon-nects," ASME J. Electron. Packag., 120, pp. 24-34.
16. Ohno, N., Kawahata, M., and Naganuma, J., 1990. "Aging Effects on Mono-tonic Stress-Paused, and Alternating Creep of Type 304 Stainless Steel," Int. J. Plast., 6. pp. 315-327.
17. Lee, K. D., and Krempl. E., 1991. "Uniaxial Thermomechanical Loading. Numerical Experiments Using the Thermal Viscoplasticity Theory Based on Overstress," Eur. J. Mech. A/Solids. 10. pp. 173-192.
18. Freed, A. D., and Walker. K. P., 1993. "Viscoplasticity with Creep and Plastic Bounds," Int. J. Plast., 9. pp. 213-242.
19. Kawai, M., 1994. "A Constitutive Model for Anisotropie Creep Deformation," ASME J. Eng. Mater. Teehnol., 116. pp. 142-147.
20. Skipor, A. F," Harren, S. V., and Botsis, J., 1996. "On the Constitutive Rela-tionship of 63/37 Sn/Pb Eutectic Solder," ASME J. Eng. Mater. Teehnol., 118, pp. 1-8.
21. Chang, F. S., Song. Y., Lu, D. X., and DeSilva. C. N., 1998. "Unified Consti-tutive Equations of Foam Materials," ASME J. Eng. Mater. Teehnol., 120. pp. 212-217.
22. Maciucescu, L., Sham. T-L., and Krempl. E., 1999. "Modeling the Deforma-tion Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)," ASME J. Electron. Packag., 121, pp. 92.