Time-dependent cyclic deformation and failure of 63Sn/37Pb solder alloy

International Journal of Fatigue

Volumn 25, Issue 6, 2003, Pages 533-546

  Yang, X J ^a,c   Chow, C L ^a   Lau, K J ^b  

^a UNIVERSITY OF MICHIGAN DEARBORN   (United States)

^b HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^c SOUTHWEST JIAOTONG UNIVERSITY   (China)

Author keywords

Creep; Cyclic failure; Cyclic loading; Damage evolution; Dwell sensitivity; Low cycle fatigue; Ratchetting; Solder; Strain rate effect

Indexed keywords

CREEP; CYCLIC LOADS; FAILURE ANALYSIS; FATIGUE TESTING; STRAIN RATE; STRESS ANALYSIS;

CYCLIC DEFORMATION; DWELL SENSITIVITY;

SOLDERING ALLOYS;

EID: 0037409962     PISSN: 01421123     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0142-1123(02)00150-0     Document Type: Article

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