Damage mechanics of surface mount technology solder joints under concurrent thermal and dynamic loading

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 2, 1999, Pages 61-68

  Chandaroy, R ^a   Basaran, C ^b  

^a HKS ABAQUS Inc   (United States)

^b UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DYNAMIC LOADS; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FRACTURE MECHANICS; MATHEMATICAL MODELS; SOLDERED JOINTS; THERMAL STRESS; VIBRATIONS (MECHANICAL);

DAMAGE MECHANICS; THERMAL CYCLING;

SURFACE MOUNT TECHNOLOGY;

EID: 0032662166     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792669     Document Type: Article

References (49)

1. ANSYS, 1992, User’s Manual, Swanson Analysis Systems Inc., Version 5.3.
2. ABAQUS, 1996, User’s Manual, Hibbit, Karlsson and Sorrensen Inc., Version 5.6.
3. Barker, D., Vodzak, J., Dasgupta, A., and Pecht, M., 1990, “Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach,” ASME Journal of Electronic Packaging, Vol. 112, pp. 129-134.
4. Basaran, C., and Chandaroy, R., 1999a, “Nonlinear Dynamic Analysis of Surface Mount Interconnects, Part 1: Theory,” ASME Journal of Electronic Packaging, March, Vol 121.
5. Basaran, C., and Chandaroy, R., 1999b, “Nonlinear Dynamic Analysis of Surface Mount Interconnects, Part II: Applications,” ASME Journal of Electronic Packaging, March, Vol 121.
6. Basaran, C., and Desai, C. S., and Kundu, T., 1998, “Thermomechanical Finite Element Analysis of Microelectronics Packaging, Part I: Theory,” ASME Journal of Electronic Packaging, Vol 120, (1), 41-47.
7. Blanks, H. S., 1976, “Accelerated Vibration Fatigue Life Testing of Leads and Solder Joint,” in Microelectronics and Reliability, Pergamon Press, Vol. 15, pp. 213-219.
8. Bonda, N. R., and Noyan, I. C., 1996, “Effect of the Specimen size in Predicting the Mechanical properties of PbSn Solder Alloys,” IEEE Trans, on Comp. Pack, and Manuf. Tech., Part A, Vol. 19, No. 2.
9. Bathe, K. B., 1996, Finite Element Procedures in Engineering Analysis, Prentice Hall, Inc., Englewood Cliffs, NJ.
10. Clech, I.-P., and Augis, J. A., 1987, “Engineering Analysis of Thermal Cycling Accelerated Test for Surface-Mount Attachment Reliability Evaluation,” Proceedings, VII Annual Electronic Packaging Conf., Vol. 1, pp. 385-411.
11. Clough, R. W., and Penzien, J., 1993, Dynamics of Structures, McGraw-Hill, New York.
12. Coffin, Jr., L. F., 1954, Trans, of ASME, Vol. 76, pp. 931-950.
13. Coffin, Jr., L. F., 1969, Fracture 1969, Chapman and Hall, London.
14. Cosserat, E., and Cosserat, F., 1909, Theorie des Corps Deformables, Herman, Paris, France.
15. Darveaux, R., Edward, Y., Turlik, I., and Murthy, K. I, 1991, “Mechanical Characteristics of IN and Pb55Sn Solders in a Thinfilm Multichip Package,” Proceedings, Mat. Res. Symp. Vol. 203, pp. 443-449.
16. Dasgupta, A., Oyan, C., Barker, D., Pecht, M., 1992, “Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach,” ASME Journal of Electronic Packaging, Vol. 114.
17. Desai, C., 1995, “Constitutive Modeling Using the Disturbed State Concept,” chap. 8 in Continuum Models for Materials with Microstructure, H. B. Muhlhars, ed., John Wiley &Sons, UK.
18. Frear, D. R., Burchet, S. N., and Rashid, M. M., 1995, “A Microstructurally Based Model of Solder Joints Under Conditions of Thermomechanical Fatigue,” Proceedings, Advances in Electronic Packaging, EEP-Vol. 10, ASME, New York, pp. 347-360.
19. Guo, Q., Cutiongco, E. C., Keer, L. M., and Fine, M. E., 1992, “Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder,” ASME Journal of Electronic Packaging, Vol. 114, pp. 145-151.
20. Hall, P. M., and Sherry, W. M., 1986, “Materials, Structures and Mechanics of Solder-Joints for Surface-Mount Microelectronics Technology,” Proceedings, Lectures of the 3rd International Conference on Techniques de Connexion en Eiectronique, Feb, 18-20, Welding Society, Fellbach, Dusseldorf, Germany.
21. Harper, C. A., 1970, Handbook of Materials and Processes for Electronics, McGraw Hill, New York, pp. 9-71.
22. Huang, J. H., Pei, J. Y., Qian, Y. Y., Jiang, Y. H., 1994, “Life Predictions of SMT Solder Joints Under Thermal Cycling,” Soldering and Surface Mount Technology, Vol. 16, pp. 31-50.
23. Hill, R., 1950, The Mathematical Theory of Plasticity, Oxford University Press, Oxford, UK.
24. Ishikawa, H., and Sasaki, K., 1992, “Constitutive Model for 60Sn-40Pb Solder Under Cycling Loading,” Advances in Electronic Packaging, Proceedings, Joint ASME/JSME Conf. on Electronic Packaging, W. T. Chen, and H. Abe, eds.; Vol. 1, pp. 401-408.
25. Kachanov, L. M., 1986, Introduction of Continuum Damage Mechanics, Mar-tinus Nijhoff Publishers, Dordrecht, The Netherlands.
26. Knecht, S., and Fox, L. R., 1990, “Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder,” IEEE Trans, on Comp. Hybr. and Manufacturing Technology, Vol. 13, No. 2, pp. 424-433.
27. Lau, J., and Erasmus, S., 1993, “Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending Twisting and Thermal Conditions,” ASME Journal of Electronic Packaging, Vol. 115, pp. 322-328.
28. Manson, S. S., 1953, “Behavior of Materials Under Conditions of Thermal Stress,” Proceedings, Heat Transfer Symp., Univ. of Michigan Press, Ann Arbor, MI.
29. Manson, S. S., 1960, Mechanical Design, Vol. 32 (14), pp. 139-144.
30. Markstein, H. W., 1987, “Designing Electronics for High Vibration and Shock,” Electronic Packaging and Production, April, pp. 40-43.
31. MIL-HDBK-304, Military Standards Handbook.
32. Miner, M. A., 1945, “Cumulative Damage in Fatigue,” ASME Journal of Applied Mechanics, Sept.
33. Oshida, Y., and Chen, P., 1991, “High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure,” ASME Journal of Electronic Packaging, Vol. 113.
34. Owen, D. R. J., and Hinton, E., 1980, Finite Elements in Plasticity, Pineridge Press Limited, Swansea, U.K.
35. Ozmat, B., 1990, “A Nonlinear Thermal Stress Analysis of Surface Mount Solder Joints,” Proceedings, 40th Electronic Components &Technology Conference.
36. Pan, T., 1991, “Thermal Cycling Induced Plastic Deformation in Solder Joints: Part III: Strain-Energy Based Fatigue Life Model and Effects of Ramp Rate and Hold Time,” Proceedings, ASME Winter Annual Meeting, ASME, New York.
37. Pao, Y. H., Govila, R., Badgley, S., and Jih, E., 1993, “An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints,” ASME Journal of Electronic Packaging, Vol. 115, pp. 1-8.
38. Perzyna, P., 1966, “Fundamental Problems in Viscoplasticity,” in Recent Advances in Applied Mechanics, Academic Press, New York.
39. Ross, R. G., Wen, L. C., Mon, G. R., and Jetter, E., 1992, “Solder Crep-Fatigue Interactions with Flexible Leaded Parts,” ASME Journal of Electronic Packaging, Vol. 114, pp. 185-192.
40. Sauber, J., and Seyyedi S, 1992, “Predicting Thermal Fatigue Lifetimes for SMT Solder Joints,” ASME Journal of Electronic Packaging, Vol. 114, pp. 472-476.
41. Schmidt, C. G., 1992, “A Simple Model for Fatigue of Leadless Ceramic Chip Carrier Solder Attachments,” J. Electronic Manuf, Vol. 2, pp. 31-36.
42. Skipor, A., Harren, S., and Botsis, J., 1992, “Constitutive Characterization of 63/37 Sn/Pn Eutectic Solder Using the Bodner-Partom Unified Creep-Plasticity Model,” Advances in Electronic Packaging, Proceedings, Joint ASME/JSME Conf. on Electronic Packaging, Vol. 2, W. T. Chen, and H. Abe, eds., ASME, New York, pp. 661-672.
43. Solomon, H. D., and Tolksdorf, E. D., 1996, “Energy Approach to the Fatigue of 60/40 Solder: Part II—Influence of Hold Time and Asymmetric Loading,” ASME Journal of Electronic Packaging, Vol. 118, pp. 67-71.
44. Subrahmanyan, R., Wilcox, J. R., and Li, C., 1989, “A Damage Integral Approach to Thermal Fatigue of Solder Joints,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12, No. 4.
45. Steinberg, D. S., 1988, Vibration Analysis for Electronic Equipment, John Wiley &Sons, New York.
46. Suhir, E., and Lee, Y. C., 1988, “Thermal, Mechanical and Environmental Durability Design Methodologies,” Electronics Materials Handbook, Vol. 1, ASM International.
47. Tien, J. K., Headrix, B.C., and Attarwala, A.I., 1991, “Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder,” ASME Journal of Electronic Packaging, Vol. 113.
48. Verma, S., Dasgupta, A., and Barker, D., 1993, “A Numerical Study of Fatigue Life of J-Leaded Solder Joints Using the Energy Partitioning Approach,” ASME Journal of Electronic Packaging, Vol. 115, pp. 416-423.
49. Zubelewicz, A., Guo, Q., Cutiongco, E. C., Fine, M. E., and Kheer, L. M., 1990, “Micromechanical Method to Predict Fatigue Life of Solder,” ASME Journal of Electronic Packaging, Vol. 112.