Elastic-plastic-creep simulation of Pb/Sn solder alloys by separation of plastic and creep

JSME International Journal, Series A: Solid Mechanics and Material Engineering

Volumn 46, Issue 4, 2003, Pages 559-566

  Ohguchi, Ken Ichi ^a   Sasaki, Katsuhiko ^b  

^a AKITA UNIVERSITY   (Japan)

^b HOKKAIDO UNIVERSITY   (Japan)

Author keywords

Constitutive model; Creep; Cyclic plasticity; Electronic packaging; Pb Sn solder; Stress relaxation; Time dependent deformation

Indexed keywords

COMPUTER SIMULATION; CREEP; DEFORMATION; ELASTICITY; PLASTICITY; SOLDERING ALLOYS; STRESS RELAXATION; TENSILE STRESS; TENSILE TESTING;

MATERIAL PARAMETERS; STRAIN RATES;

LEAD ALLOYS;

ALLOY;

EID: 0348108171     PISSN: 13447912     EISSN: None     Source Type: Journal    
DOI: 10.1299/jsmea.46.559     Document Type: Article

References (8)

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2. Mukai, M., Kawakami, T., Takahashi, K., Kishimoto, K. and Shibuya, T., Effects of Hold-Time on Thermal Fatigue Life of Solder Joints, Trans. Jpn. Soc. Mech. Eng., (in Japanese), Vol. 63, No. 611, A (1997), pp. 1594-1600.
3. Wang, S., Yu, Q. and Shiratori, M., A Study on the Method of Elastic-Plastic-Creep Finite Element Analysis for a Solder Joint in a Surface Mounted Component, Trans. Jpn. Soc. Mech. Eng., (in Japanese), Vol. 62, No. 594, A (1996), pp. 527-532.
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5. Ohguchi, K., Sasaki, K. and Ishikawa, H., Viscoplastic Deformation of 60Sn-40Pb Solder Alloys (Description of Strain Rate Effect), Trans. Jpn. Soc. Mech. Eng., (in Japanese), Vol. 63, No. 609, A (1997), pp. 954-961.
6. JSME, Computational Mechanics Handbook, (in Japanese), (1998), pp. 145, Maruzen.
7. Ohguchi, K. and Sasaki, K., Description of Temperature Dependence and Creep Deformation of 60Sn-40Pb Solder Alloys, JSME Int. J. Ser. A, Vol. 44, No. 1 (2001), pp. 82-88.
8. JSME, Materials and Mechanics Handbook, (in Japanese), (1999), p. 176, Maruzen.