Investigation of a new lead free solder alloy using thin strip specimens

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 4, 1999, Pages 271-274

  Ren, W ^a   Qian, Z ^a   Lu, M ^a   Liu, S ^a   Shangguan, D ^b  

^a Wayne State University   (United States)

^b FORD MOTOR COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0345826453     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2793851     Document Type: Article

References (17)

1. Adams, P. J., 1997, “Thermal Fatigue of Solder Joints in Micro-Electronic Devices,” M.S. thesis, Dept, of Mech. Eng., MIT, Cambridge, MA.
2. CINDAS, 1997, SRC Document, Purdue University, West Lafayette, IN.
3. Darveaux, R., and Banerji, K., 1992, “Constitutive Relations for Tin-Based Solder Joints,” IEEE Trans, on Components, Hybrids, and Manufacturing Tech., Vol. 15, No. 6, pp. 1013-1024.
4. Ewell, G. J., and Robertson, S. R., 1996, “Development of Pb-free Solder: An Overview,” Proceedings, The Second Int. Symp. on Elec. Packag. Tech., Shanghai, China, pp. 73-78.
5. Frear, D. R., Jones, W. B., and Kinsman, K. R., 1990, Solder Mechanics, A State of the Art Assessment, TMS, New Mexico.
6. Frear, D. R., 1989, “Thermo-Mechanical Fatigue of Solder Joints: A New Comprehensive Test Method,” IEEE Trans, on Components, Hybrids, and Manufacturing Tech., Vol. 12, pp. 492-501.
7. Glazer, J., 1994, “Microstructure and Mechanical Properties of Pb-Free Solder Alloys for Low-Cost Electronic Assembly: A Review,” J. Elec. Mat., Vol. 23, pp. 693-700.
8. Kang, S. K., 1994, “Lead(Pb)-Free Solders for Electronic Packaging,” J. Elec. Mat., Vol. 23, pp. 701-707.
9. Lau, J. H., 1991, Solder Joint Reliability, Van Nostrand Reinhold, New York.
10. Lu, M., Ren, W., and Liu, S., 1996, “A Unique Multi-Axial Thermo-Mechanical Fatigue Tester For Electronic Packaging Materials,” presented at the Second International Symposium on Electronic Packaging Technology, Shanghai, Dec. 9-12. China.
11. Lu, M., and Liu, S., 1996, “A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials,” in Sensing, Modeling and Simulation in Emerging Electronic Packaging, ASME, EEEP-Vol. 17, pp. 87-92.
12. Ren, W., Lu, M., Liu, S., and Shangguan, D., 1997, “Thermal Mechanical Property Testing of New Lead Free Solder Joints,” Journal of Soldering & Surface Mount Technology, Vol. 9, No. 3, pp. 37-40.
13. Shangguan, D., Achari, A., and Green, W., 1994, “Application of Lead Free Eutectic Sn-Ag Solder in No-Clean Thick Film Electronic Modules,” IEEE Trans, on Components, Packaging, and Manufacturing Tech.—Part B, Vol. 17, pp. 603-611.
14. Shangguan, D., and Gao, G., 1996, “Environmentally Conscious Manufacturing Technologies for Automotive Electronics,” Proceedings, Second Inter. Symp. on Electronic Packg. Tech., Shanghai, China, pp. 391-402.
15. Shangguan, D., and Achari, A., 1995, United States Patent, Patent Number: 5, 429, 689, Jul. 4, 1995.
16. Xie, D. J., Chan, Y. C., Lai, J. K. L., and Hui, I. K., 1996, “Fatigue Life Estimation of Surface Mount Solder Joints,” IEEE Trans, on Components, Packaging, and Manufacturing Tech.˜Part B, Vol. 19, No. 3, pp. 669-677.
17. Zhang, Z., Yao, D., and Shang, J. K., 1996, “Fatigue Crack Initiation in Solder Joints,” ASME Journal oh Electronic Packaging, Vol. 118, pp. 41-44.