Thermoplastic finite element analysis of unfilled plated-through holes during wave soldering

Journal of Electronic Packaging

Volumn 124, Issue 1, 2002, Pages 45-53

  Fu, Chia Yu ^a   McDowell, David L ^b   Urne, I Charles ^b  

^a MOTOROLA INC   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0040675414     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1401737     Document Type: Article

References (17)

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