Modeling the deformation behavior of a sn-pb solder alloy using the simplified viscoplasticity theory based on overstress (VBO)

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 2, 1999, Pages 92-98

  Maciucescu, L ^a   Sham, T L ^a   Krempl, E ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; CYCLIC LOADS; DEFORMATION; LEAD ALLOYS; MATHEMATICAL MODELS; STRAIN; STRESS ANALYSIS; TENSILE TESTING; TIN ALLOYS; VISCOPLASTICITY; YIELD STRESS;

VISCOPLASTICITY THEORY BASED ON OVERSTRESS;

SOLDERING ALLOYS;

EID: 0032626766     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792673     Document Type: Article

References (14)

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