A viscoplastic constitutive model for 63sn37Pb eutectic solders

Journal of Electronic Packaging

Volumn 124, Issue 2, 2002, Pages 91-96

  Yi, Sung ^a   Luo, Guangxing ^a   Chian, Kerm Sin ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0040671358     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1451845     Document Type: Article

References (20)

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