Plasticity-creep separation method for viscoplastic deformation of lead-free solders

JSME International Journal, Series A: Solid Mechanics and Material Engineering

Volumn 47, Issue 3, 2004, Pages 371-379

  Ohguchi, Ken ichi ^a   Sasaki, Katsuhiko ^b   Ishibashi, Masahiro ^c   Hoshino, Takamichi ^c  

^a AKITA UNIVERSITY   (Japan)

^b HOKKAIDO UNIVERSITY   (Japan)

^c NEC CORPORATION   (Japan)

Author keywords

Constitutive model; Creep; Cyclic loading; Electronic packaging; Finite element method; Lead free solder alloy; Residual stress; Strain rate effect; Stress relaxation; Temperature effect

Indexed keywords

CREEP; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; PLASTIC DEFORMATION; STRAIN RATE; TENSILE TESTING;

LEAD-FREE SOLDER ALLOYS; PLASTICITY-CREEP SEPARATION METHOD; VOSCOPLASTIC DEFORMATIONS;

SOLDERING ALLOYS;

VISCOPLASTICITY;

EID: 4744352564     PISSN: 13447912     EISSN: None     Source Type: Journal    
DOI: 10.1299/jsmea.47.371     Document Type: Article

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