Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept: Part 2-verification and application

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 1, 1998, Pages 48-53

  Basaran, C ^a   Desai, C S ^b   Kundu, T ^b  

^a the State University of New York   (United States)

^b University of Arizona   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; FINITE ELEMENT METHOD; SEMICONDUCTOR DEVICE MODELS; SOLDERING ALLOYS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; VISCOPLASTICITY;

DISTRIBUTED STATE CONCEPT;

ELECTRONICS PACKAGING;

EID: 0032028050     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792285     Document Type: Article

References (15)

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