Selecting a temperature time history for predicting fatigue life of microelectronics solder joints

Journal of Thermal Stresses

Volumn 24, Issue 11, 2001, Pages 1063-1083

  Basaran, Cemal ^a   Dishongh, Terry ^b   Zhao, Ying ^c  

^a UNIVERSITY AT BUFFALO   (United States)

^b INTEL CORPORATION   (United States)

^c ANALOG DEVICES INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035603556     PISSN: 01495739     EISSN: 1521074X     Source Type: Journal    
DOI: 10.1080/01495730152620069     Document Type: Article

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