Thermo-mechanical finite element analysis in a multichip build up substrate based package design

Microelectronics Reliability

Volumn 44, Issue 4, 2004, Pages 611-619

  Zhang, Xiaowu ^a   Wong, E H ^a   Lee, Charles ^b   Chai, Tai Chong ^a   Ma, Yiyi ^a   Teo, Poi Siong ^a   Pinjala, D ^a   Sampath, Srinivasamurthy ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MULTICHIP MODULES; RELIABILITY; SENSITIVITY ANALYSIS; SOLDERING; SUBSTRATES; THERMAL EXPANSION; THICKNESS MEASUREMENT;

PACKAGE DESIGN; SOLDER JOINT RELIABILITY;

INTEGRATED CIRCUIT LAYOUT;

EID: 1542715793     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2003.09.006     Document Type: Article

References (16)

1. James J.L. Multichip module design, fabrication, and testing. 1995;McGraw-Hill, Inc. New York.
2. Pecht M. Integrated circuit, hybrid, and multichip module package design guidelines: a focus on reliability. 1993;John Wiley & Sons, Inc. New York.
3. Tay AAO, Ong SH, Lee LW. Finite element analysis of plastic-encapsulated multi-chip packages. In: Proceedings of the 2nd Electronics Packaging Technology Conference, EPTC'98, Singapore; December 1998. p. 170-6.
4. Katragadda P., Bhattacharya S., Grosse I.R. A computer aided design tool for robust multichip module package design. IEEE Trans. Component, Packag. Manufact. Technol. Pt. B. 17(3):1994;383-394.
5. Sur B., Turlik I. Power cycling and stress variation in a multichip module. IEEE Trans. Component, Packag. Manufact. Technol. Pt. B. 18(2):1995;388-395.
6. Narayanan R, Hall PM, Chanchani R. Thermal and mechanical analysis of flip-chips on a liquid-cooled multichip module. In: Proceedings of the 43rd Electronic Components and Technology Conference, ECTC 1993, Orlando, FL; June 1993. p. 22-31.
7. Hannemann R., Kraus A.D., Pecht M. Semiconductor packaging: a multidisciplinary approach. 1994;John Wiley & Sons, Inc. New York.
8. Dunne R, Sitaraman SK. Thermo-mechanical modeling of a novel MCM-DL technology. In: Proceedings of the 46th Electronic Components and Technology Conference, ECTC 1996, Orlando, FL; May 1996. p. 815-20.
9. Dasgupta A., Oyan C., Barker D., Pecht M. Solder creep-fatigue analysis by an energy-partitioning approach. ASME Trans: J. Electron. Packag. 114:1992;152-160.
10. Zhang X., Ricky Lee S.-W., Choi K.S., Kim Y.G. Computational parametric analyses on the solder joint reliability of bottom leaded plastic (BLP) package. IEEE Trans. Advanced Packag. Technol. 25(4):2002;514-521.
11. Zhang X., Ricky Lee S.-W., Pao Y.-H. A damage evolution model for thermal fatigue of solder joints. ASME Trans: J. Electron. Packag. 122(3):2000;200-206.
12. Darveaux R., Banerji K., Mawer A., Dody G. Reliability of plastic ball grid array assembly. Lau J. Ball grid array technology. 1994;379-442 McGraw-Hill, New York. [Chapter 13].
13. Chai TC, Lee C, Ma YY, Wong EH, Zhang X, Pinjala D, et al. Reliability assessment of flip chip on build up laminate based multi-chip package. In: Proceedings of the 52nd Electronic Components and Technology Conference, ECTC 2002, San Diego, CA; May 2002. p. 747-52.
14. Zhang X, Lee C, Wong EH, Iyer MK, Teo PS, Pinjala D, et al. Thermo-mechanical analysis for a multi chip build up substrate based package. In: Proceedings of the 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2001, Singapore; July 2001. p. 67-72.
15. Sawada Y., Harada K., Fujioka H. Study of package warp behavior for high-performance flip-chip BGA. Microelectron. Reliab. 43:2003;465-471.
16. van Driel W.D., Zhang G.Q., Janssen J.H.J., Ernst L.J., Su F., Chian K.S., et al. Prediction and verification of process induced warpage of electronic packages. Microelectron. Reliab. 43:2003;765-774.