Thermomechanical behavior of micron scale solder joints under dynamic loads

Mechanics of Materials

Volumn 32, Issue 3, 2000, Pages 161-173

  Zhao, Y ^a   Basaran, C ^a   Cartwright, A ^a   Dishongh, T ^b  

^a UNIVERSITY AT BUFFALO   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; DYNAMIC LOADS; ELASTICITY TESTING; ELECTRODYNAMICS; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; INTERFEROMETRY; RELIABILITY; SHOCK TESTING; STRAIN; THERMAL EFFECTS; VIBRATIONS (MECHANICAL);

ELECTRODYNAMIC SHAKER; INELASTIC STRAIN FIELD; MOIRE INTERFEROMETRY; THERMAL ENVIRONMENTAL CHAMBER; THERMOMECHANICAL BEHAVIOR;

SOLDERED JOINTS;

EID: 0034158821     PISSN: 01676636     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-6636(99)00053-8     Document Type: Article

References (15)

1. Basaran C., Chadaroy R. Mechanics of Pb40/Sn60 near eutectic solder alloys subjected to vibrations. Applied Mathematical Modeling. 22:1998;601-627.
2. Basaran C., Chadaroy R. Nonlinear dynamic analysis of surface mount interconnects: Part I. Theory. ASME Journal of Electronic Packaging. 121(1):1999a;8-12.
3. Basaran C., Chadaroy R. Nonlinear dynamic analysis of surface mount interconnects: Part II. Applications. ASME Journal of Electronic Packaging. 121(1):1999b;12-18.
4. Basaran, C., Zhao, Y., 1999. Closed form vs. finite element analysis of laminated stacks. International Journal of Finite Elements in Analysis and Design, accepted for publication
5. Chandaroy, R., 1998. Damage mechanics of microelectronic packaging under combined dynamic and thermal loading. Ph.D. dissertation, SUNY at Buffalo
6. Ham S.-J., Lee S.-B. Experimental study for reliability of electronic packaging under vibration. Experimental Mechanics. 36(4):1996;339-344.
7. Lau, J.H., Rice, D.W., 1985. Solder joint fatigue in surface mount technology: state of the art. Solid State Technology, 91-104
8. Lau J., Powers-Maloney L.M., Baker J.R., Rice D., Shaw B. Solder joint reliability of fine pitch surface mount technology assemblies. IEEE Transactions on CHMT. 13(3):1990;534-544.
9. Liguore, S., Followell, D., 1995. Vibration fatigue of surface mount technology (SMT) solder joints. In: 1995 Proceedings Annual Reliability and Maintainability Symposium, pp. 18-26
10. Markstein, H.W., 1987. Designing electronics for high vibration and shock. Electronic Packaging and Production, 40-43
11. Post D., Han B., Ifju P. High Sensitivity Moiré 1994;Springer, New York.
12. Sidharth, Barker, D.B., 1995. Vibration induced fatigue life estimation of corner leads of peripheral leaded components. In: 1995 ASME International Mechanical Engineering Congress and Exposure
13. Steinberg D.S. Vibration Analysis for Electronic Equipment. 1988;Wiley, New York.
14. Wong T.-L., Stevens K.K., Wang G. Experimental model analysis and dynamic response prediction of PC boards with surface mount electronic components. Journal of Electronic Packaging. 113:1991;244-249.
15. Zhao, Y., Basaran, C., Cartwright, A., Dishongh, T., 1999. An experimental observation of thermomechanical behavior of BGA solder joints by Moiré Interferometry. Journal of Mechanical Behavior of Materials, 10 (3), 135-146