Fatigue analysis of high-speed photodiode submodule by using FEM

Microelectronics Reliability

Volumn 44, Issue 1, 2004, Pages 167-171

  Kim, K S ^a   Kim, H I ^b   Yu, C H ^c   Chang, E G ^b  

^a Yeojoo Institute of Technology   (South Korea)

^b Chung Ang University   (South Korea)

^c Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION; BONDING; CREEP; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MULTICHIP MODULES; PHOTODIODES; STRAIN; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; VISCOPLASTICITY; WIRELESS TELECOMMUNICATION SYSTEMS;

BUMP MATERIALS; SOLDER INTERCONNECTS;

ELECTRONICS PACKAGING;

EID: 0346781564     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2003.07.001     Document Type: Article

References (12)

1. Gilbert Barry K., Pan G.W. MCM packaging for present and next generation high clock rate digital and mixed signal electronic systems. IEEE Trans. Microwave Theory Tech. 45:1997;1819-1835.
2. Oppermann Marry. Multichip modulus (MCM) for micro and milimeter wave applications a challenge. International Conference on Multichip Modules and High Density Packaging, 1998. p. 279-84.
3. Basaran C., Chandary R. Finite element simulation of the temperature cycling tests. IEEE Trans. Comp. Hybrids Manufact. Technol. 20:1997;530-536.
4. Mickelson A.R., Basavanhally N.R., Lee Y.C. Optoelectronic packaging. 1997;Wiley, New York. [Chapter 5].
5. Kuang Jao-Hwa, Sheen Maw-Tyan Effect of temperature cycling on joint strength of PbSn and AuSn solders in laser packages. IEEE Trans. Adv. Packaging. 24:2001;563-568.
6. Lee W.W., Nguyen L.T. Solder joint fatigue models: review and applicability to chip scale packages. Microelectron. Reliab. 40:2000;231-244.
7. Darveaux R., Banerji K. Constitutive relations for tin-based solder joints. IEEE Trans. Comp. Hybrids Manufact. Technol. 15:1992;1013-1024.
8. Fusaro J., Darveaux R. Reliability of copper base-plate high current power modules. Int. J. Microcirc. Electron. Packaging. 20:1997;81-88.
9. Swanson Analysis Systems Inc. ANSYS user's manual, 2001.
10. Optimal Corporation. PakSi-TM user manual, 2001.
11. Lau J.H., Pao Y.H. Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies. 1997;McGraw-Hill, New York.
12. Darveaux R. Effect of simulation methodology on solder joint crack growth correlation. 50th IEEE Electron Comp Technol Conf, 2000.