Recent advances in modeling the underfill process in flip-chip packaging

Microelectronics Journal

Volumn 38, Issue 1, 2007, Pages 67-75

  Wan, J W ^a   Zhang, W J ^b   Bergstrom, D J ^b  

^a GUANGZHOU UNIVERSITY   (China)

^b UNIVERSITY OF SASKATCHEWAN   (Canada)

Author keywords

Flip chip packaging; Model; Underfill flow

Indexed keywords

COMPUTER SIMULATION; FLIP CHIP DEVICES; MATHEMATICAL MODELS; SILICON; STRESS CONCENTRATION; THERMAL EXPANSION;

CAPILLARY ACTION; FLIP-CHIP PACKAGING TECHNOLOGY; SOLDER BUMP RESISTANCE; UNDERFILL FLOW;

CHIP SCALE PACKAGES;

EID: 33845201909     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2006.09.017     Document Type: Article

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