The investigation of the capillary flow of underfill materials

Microelectronics International

Volumn 19, Issue 1, 2002, Pages 23-29

  Huang, C Y ^a  

^a Department of Industrial Management   (Taiwan)

Author keywords

Encapsulation; Flip chip; Underfill

Indexed keywords

EID: 0036238902     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360210417754     Document Type: Article

References (9)