Advanced encapsulant materials systems for flip-chip-on-board assemblies: I. Encapsulant materials with improved manufacturing properties. II. Materials to integrate the reflow and underfilling processes

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1996, Pages 1-9

  Gamota, Daniel R ^a   Melton, Cindy M ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; ELASTIC MODULI; ELECTRONICS PACKAGING; ENCAPSULATION; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RELIABILITY; SUBSTRATES; TENSILE STRENGTH; THERMAL EXPANSION; VISCOSITY;

FLIP CHIP ON BOARD (FCOB) ASSEMBLIES; FLOW PROPERTIES;

FLIP CHIP DEVICES;

EID: 0030415144     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)