The underfill processing technologies for flip chip packaging

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 119-123

  Chai, Kevin ^a   Wu, Larry ^a  

^a SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL PROTECTION; RELIABILITY; SUBSTRATES; WIRE;

UNDERFILL PROCESSING;

FLIP CHIP DEVICES;

EID: 0035791381     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Yung-Sen Lin, Kevin Chai, T. D. Her and Randy Lo, "Transfer Molded Underfill for FC-BGA", Semicon Taiwan 2000, Taipei, 2000.