Study on mold flow analysis of flip chip package

International Communications in Heat and Mass Transfer

Volumn 28, Issue 7, 2001, Pages 943-952

  Shen, Y K ^a   Ye, T W ^a   Chen, S L ^a   Yin, C H ^a   Song, W D ^a  

^a LUNGHWA UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; INJECTION MOLDING; PRESSURE DISTRIBUTION; PRESSURE DROP;

MOLD FLOW ANALYSIS;

FLIP CHIP DEVICES;

FLOW ANALYSIS; HEAT TRANSFER; INJECTION MOLDING; MOLD; PROCESS CONTROL;

EID: 0035438790     PISSN: 07351933     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0735-1933(01)00298-6     Document Type: Article

References (6)