Underfill flow as viscous flow between parallel plates driven by capillary action

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 19, Issue 2, 1996, Pages 133-137

  Schwiebert, Matthew K ^a   Leong, William H ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARY FLOW; ELECTRIC WIRING; LAMINAR FLOW; MATHEMATICAL MODELS; NAVIER STOKES EQUATIONS; PARTIAL DIFFERENTIAL EQUATIONS; REYNOLDS NUMBER; SURFACE ROUGHNESS; SURFACE TENSION; VISCOSITY; VISCOUS FLOW;

FLIP CHIP INTERCONNECTS; SCANNING ELECTRON MICROGRAPH;

FLIP CHIP DEVICES;

EID: 0030121020     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.507149     Document Type: Article

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