Characteristics and reliability of fast-flow, snap-cure, and reworkable underfills for solder bumped flip chip on low-cost substrates

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 25, Issue 3, 2002, Pages 231-239

  Lau, John H ^a,b   Chang, Chris ^b  

^a IEEE   (United States)

^b AGILENT TECHNOLOGIES   (United States)

Author keywords

Fast flow; Flip chip; Reliability; Reworkable underfills; Snap cure; Solder bumps

Indexed keywords

CALORIMETERS; CURING; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; MECHANICAL TESTING; PHYSICAL PROPERTIES; RELIABILITY; SUBSTRATES;

FAST FLOW; REWORKABLE UNDERFILLS; SNAP-CURE; SOLDER BUMPED FLIP CHIP; SOLDER BUMPS;

FLIP CHIP DEVICES;

EID: 0036665813     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2002.804612     Document Type: Article

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