Flip chip underfill flow characteristics and prediction

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 3, 2000, Pages 420-427

  Fine, P ^a   Cobb, B ^b   Nguyen, L ^a  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

^b NOVELLUS SYSTEMS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT ANGLE; DIES; ELECTRONICS PACKAGING; FILLERS; INTEGRATED CIRCUIT TESTING; MICROPROCESSOR CHIPS; PARTICLE SIZE ANALYSIS; QUARTZ; SUBSTRATES; VISCOSITY OF LIQUIDS;

BUMP PITCH; FLIP CHIP UNDERFILLS;

FLIP CHIP DEVICES;

EID: 0034275034     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.868839     Document Type: Article

References (3)

1. L. Nguyen, C. Quentin, P. Fine, B. Cobb, S. Bayyuk, H. Yang, and S. Bidstrup-Allen, "Underfill of flip chip on laminates: Simulation and validation," in Proc. 3rd. Int. Conf. Adhesive Join Coating Tech. Electron. Manufact., Binghamton, NY, Sept. 1998, pp. 312-320.
2. G. Lehman, A. Maria, P. C. Lee, and E. J. Cotts, "Modeling the underfill flow process," in Proc. Surface Mount Int., San Jose, CA, Sept. 1996, pp. 340-350.
3. P. C. Li, E. J. Cotts, Y. Guo, and G. L. Lehmann, "Viscosity measurements and models of underfill mixtures," in Proc. 3rd Int. Conf. Adhesive Join Coating Tech. Electron. Manufact., Binghamton, NY, Sept. 1998, pp. 328-333.