Encapsulation of flip chip structures

13th IEEE/CHMT International Electronics Manufacturing Technology Symposium - Integrated Manufacturing: The Future Is Now, IEMT 1992

Volumn , Issue , 1992, Pages 53-58

  Machuga, Steven C ^a   Lindsey, Scott E ^a   Moore, Kevin D ^a   Skipor, Andrew F ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; INDUSTRIAL ELECTRONICS; INTEGRATED CIRCUIT INTERCONNECTS; RELIABILITY ANALYSIS; SUBSTRATES; THERMAL CYCLING; THERMAL EXPANSION; THERMAL FATIGUE;

FLIP CHIP ASSEMBLIES; FLIP CHIP INTERCONNECTS; FLIP CHIP TECHNOLOGIES; GEOMETRICAL DESIGNS; INTERCONNECT INDUCTANCE; MATERIAL REQUIREMENTS; PRINTED WIRE BOARDS; THERMAL CYCLE RELIABILITY;

FLIP CHIP DEVICES;

EID: 85032143232     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.1992.639861     Document Type: Conference Paper

References (12)

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