An analytical model for predicting the underfill flow characteristics in flip-chip encapsulation

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 3, 2005, Pages 481-487

  Wan, J W ^a   Zhang, W J ^b   Bergstrom, D J ^b  

^a GUANGZHOU UNIVERSITY   (China)

^b UNIVERSITY OF SASKATCHEWAN   (Canada)

Author keywords

Analytical model; Flip chip package; Power law constitutive equation; Surface tension; Underfill flow; Washburn model

Indexed keywords

CAPILLARY FLOW; ENCAPSULATION; FLIP CHIP DEVICES; MATHEMATICAL MODELS; NON NEWTONIAN FLOW; NUMERICAL ANALYSIS; OPTIMIZATION; SOLDERING; SURFACE TENSION;

ANALYTICAL MODEL; FLIP-CHIP ENCAPSULATION; FLIP-CHIP PACKAGE; POWER-LAW CONSTITUTIVE EQUATION; SOLDER BUMP; UNDERFILL FLOW; WASHBURN MODEL;

CHIP SCALE PACKAGES;

EID: 24644434452     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.848385     Document Type: Article

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