Influence of transient flow and solder bump resistance on underfill process

Microelectronics Journal

Volumn 36, Issue 8, 2005, Pages 687-693

  Wan, J W ^a   Zhang, W J ^b   Bergstrom, D J ^b  

^a GUANGZHOU UNIVERSITY   (China)

^b UNIVERSITY OF SASKATCHEWAN   (Canada)

Author keywords

Dynamic contact angle; Fluid filling time; Solder bump resistance; Transient effect; Underfill flow

Indexed keywords

COMPUTER SIMULATION; CONTACT ANGLE; DIFFERENTIAL EQUATIONS; FEEDBACK; FLOW OF FLUIDS; MATHEMATICAL MODELS; MICROELECTRONICS; OPTIMIZATION; SOLDERING ALLOYS; VISCOSITY;

DYNAMIC CONTACT ANGLE; FLUID FILLING TIME; SOLDER BUMP RESISTANCE; TRANSIENT EFFECT; UNDERFILL FLOW;

ELECTRONICS PACKAGING;

EID: 23744467992     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2005.05.022     Document Type: Article

References (16)

1. J. Wang Underfill of flip-chip on organic substrate: viscosity, surface tension, and contact angle Microelectronics Reliability 42 2002 293 299
2. N.W. Pascarella, and D.F. Baldin Compression flow modeling of underfill encapsulation for low cost flip-chip assembly IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C 21 4 1998 325 335
3. D.R. Gamota, and C.M. Melton Advanced encapsulant materials systems for flip-chip on board assemblies: I. Encapsulant materials with improved manufacturing properties II. Materuials to integrate the reflow and underfilling processes IEEE/CPMT International electronics manufacturing technology symposium, Austin, TX 1996 pp. 1-9
4. S. Han, and K.K. Wang Analysis of the flow of encapsulant during underfill encapsulation of flip-chips IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B 20 4 1997 424 433
5. M.K. Schwiebert, and W.H. Leong Underfill flow as viscous flow between parallel plates drvien by capillary action IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C 19 12 1996 133 137
6. G.L. Lehmann, T. Driscoll, N.R. Guydosh, P.C. Li, and E.J. Cotts Underflow process for direct-chip-attachment packaging IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A 21 2 1998 266 274
7. M.H. Gordon, G. Ni, W.F. Schmidt, and R.P. Selvam A capillary-driven underfill encapsulation process Advantaged Packaging 8 1999 34 37
8. E.W. Washburn The dynamics of capillary flow Physical Review 17 1921 273 283
9. L. Nguyen, C. Quentin, P. Fine, B. Cobb, S. Bayyuk, H. Yang, and S.A. Bidstrup-Allen Underfill of flip-chip on laminate: simulation and validation IEEE Transactions on Components and Packaging Technology 22 2 1999 168 176
10. P. Fine, B. Cobb, and L. Nguyen Flip-chip underfill flow characteristics and prediction IEEE Transactions on Components and Packaging Technology 23 3 2000 420 427
11. H. Schonhorn, H. Frisch, and T.K. Kwei Kinetics of wetting of surfaces by polymer melts Journal of Applied Physics 37 1966 4967 4973
12. S. Newman Kinetics of wetting of surfaces by polymer: capillary flow Journal of Colloid and Interface Science 26 1968 209 213
13. V. Arpaci Conduction heat transfer 1966 Addison-Wesley Publishing Company Reading, MA, USA
14. Wan, J.W., Analysis and modeling of underfill flow driven by capillary action in flip-chip packaging, PhD dissertation, University of Saskatchewan, Saskatoon, SK, Canada, 2005.
15. D.S. Kim, K.C. Lee, and T.H. Know Micro-channel filling flow considering surface tension effect Journal of Micromechanics and Microengineering 12 2002 236 246
16. M.J. Madou Fundamentals of microfabrication - the science of miniaturization 2002 CRC Press New York