Study on the pressurized underfill encapsulation of flip chips

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 20, Issue 4, 1997, Pages 434-442

  Han, Sejin ^a   Wang, K K ^a  

^a Department of Obstetrics Gynecology   (United States)

Author keywords

Encapsulant; Flip chip; Pressurized encapsulation; Process development; Underfill; Void

Indexed keywords

ENCAPSULATION; PROCESS ENGINEERING; RELIABILITY; SOLDERED JOINTS;

PRESSURIZED UNDERFILL ENCAPSULATION;

FLIP CHIP DEVICES;

EID: 0031268605     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.641512     Document Type: Article

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