Challenge of flip chip encapsulation technologies

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 733-737

  Chai, Kevin ^a   Wu, Eddy ^a   Hsieh, Roger ^a   Tong, J Y ^a  

^a SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

Capillary underfill; Encapsulation; Flip chip; MUF (molded underfill); No flow underfill; Vacuum mold

Indexed keywords

ENCAPSULATION; FLIP CHIP DEVICES; MOLDING; RELIABILITY; SUBSTRATES; THERMAL EXPANSION; VACUUM APPLICATIONS;

CAPILLARY UNDERFILL; UNDERFILL MATERIALS; VACUUM MOLDING PACKAGING;

ELECTRONICS PACKAGING;

EID: 0036448342     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Yung-Sen Lin, Kevin Chai, T. D. Her and Randy Lo, "Transfer Molded Underfill for FC-BGA", proceedings of the SEMICON Taiwan 2000, Taipei, Taiwan, September 13-15, 2000.
2. Fenny Liu, Y. P. Wang, Kevin Chai and T. D. Her, "Characterization of Molded Underfill Material for Flip Chip Ball Grid Array Packages", proceedings of the 51th Electronic Components & Technology Conference (ECTC 2001), Florida, USA, May 29-June 1, 2001.
3. Kevin Chai and Larry Wu, "The Underfill Processing for Flip Chip Packages", proceeding of the 1st International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2001), Podsdam, Germany, October 21-24, 2001.
4. Kevin Chai, Eddy Wu and J. Y. Tong, "Challenge of Vacuum Molded Flip Chip Packaging Technology", proceeding of the 2nd International IEEE Conference on Polymers and Adhesive in Microelectronics and Photonics (Polytronic 2000), Zalaegerszeg, Hungary, June 23-26, 2002.