Recent advances in plastic packaging of flip-chip and multichip modules (MCM) of microelectronics

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 1, 1999, Pages 21-25

  Wong, C P ^a   Wong, Michalle M ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; ENCAPSULATION; EPOXY RESINS; FLIP CHIP DEVICES; MICROELECTRONICS; MULTICHIP MODULES; PLASTICS APPLICATIONS; SILICA; SILICONES; THERMAL EXPANSION; VLSI CIRCUITS;

DIRECT CHIP ATTACH (DCA); THERMAL COEFFICIENT OF EXPANSION (TCE);

ELECTRONICS PACKAGING;

EID: 0033355777     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.759349     Document Type: Article

References (12)

1. R. R. Tummala and E. J. Rymaszewski, Eds., Microelectronic Packaging Handbook. New York: Van Nostrand Reinhold, 1989.
2. C. P. Wong, Polymers for Electric and Photonic Applications. San Diego, CA: Academic, 1993, pp. 167-214, ch. 4.
3. _, Polymers in Electronics, J. H. Lai, Ed. Boca Raton, FL: CRC, 1989, ch. 3, pp. 63-92.
4. _, Application of Polymers in Encapsulation of Electronic Parts, Advances of Polymer Science. Berlin, Germany: Springer-Verlag, 1988, vol. 84, pp. 63-83.
5. K. Otsuka et al., IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. CHMT-12, pp. 666-671, Dec. 1987.
6. L. T. Manzione, Plastic Packaging of Microelectronic Devices. New York: Van Nostrand Reinhold, 1990.
7. D. Suryanarayana, R. Hsiao, T. Gall, and J. McCreary, IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 14, p. 218, Mar. 1991.
8. D. W. Wang and K. I. Papothomas, in Proc. IEEE 43rd ECTC, 1993, p. 780.
9. C. P. Wong, S. Shi, and G. Jefferson, "High performance no flow underfills for low-cost flip-chip applications," IEEE Trans. Comp., Packag., Manufact. Technol. A vol. 21, pp. 400-458, Sept. 1998.
10. D. F. Baldwin and N. W. Pascarella, "Advanced encapsulation processing for low cost flip chip assembly - A cost analysis," in Proc. 3rd Int. Symp. Adv. Packag. Mater., 1997, p. 33.
11. C. P. Wong, "Silicone resin electronic device encapsulant," U.S. Patent 5275841, Jan. 4, 1994.
12. C. P. Wong, M. B. Vincent, and S. Shi, "Fast flow underfill encapsulant flow ratio and CTE," IEEE Trans. Comp., Packag., Manufact. Techanol. A, vol. 21, pp. 360-364, June 1998.